PSC is specialized in industrialization, qualification, and production of semiconductor IC’s.
Partner profile
PSC is specialized in industrialization, qualification, and production of semiconductor IC’s with full ASSEMBLY-PACKAGING and TEST capability either from its internal European lines (located in Toulouse-France) or through aggregation partnership with Tier1 Asian OSAT’s.
History and expertise
Created as a European OSAT in 2017, PSC has a unique Back-End TurnKey capability covering the entire post-silicon value chain, including:
- Packaging
- Package Design expertise, including electrical and thermal simulations
- An internal assembly line dedicated to small-mid volumes in Toulouse-France
- o A strong partnership with Tier1 Asian OSAT’s
- Test
- Test solution Development for digital, mixed, analog, RF/MMW IC’s
- Production Testing at its Toulouse test floor or at Asian partners
- Qualification-Reliability
- Jedec, AEC-Q100, ESCC compliancy
- PCB and Probe Cards
- Test loadboards & probe cards development and fabrication
- Application, validation, reliability boards
- Supply chain, logistics, and inventory management
Service offering under IC-DASH and contribution to the work package
Synergie Cad PSC, together with its strong expertise in IC’s industrialization and production, provides unique offer of post-silicon services, from small to large series, either from a fully European and internal supply chain or through its Asian Tier1 partners.
Within the framework of Work Package 2 (WP2), the services provided a comprehensive range of capabilities across packaging, testing, qualification, PCB development, and supply chain management. In the field of packaging, the offering includes expertise in package design, supported by electrical and thermal simulations, as well as access to an internal assembly line in Toulouse, France, dedicated to small- to mid-volume production of BGA, QFN, SiP, COB, and similar components.
In addition, a strong partnership with leading Tier-1 Asian OSAT providers ensures flexibility and scalability. Concerning testing, services cover the development of test solutions for digital, mixed-signal, analog, and RF/MMW integrated circuits, with production testing performed either at the Toulouse test facility or through trusted Asian partners. Qualification and reliability activities comply with recognized standards, including JEDEC, AEC-Q100, and ESCC.
Furthermore, the project includes the development and fabrication of test loadboards and probe cards, as well as the production of application, validation, and reliability boards. Finally, the provision of services is complemented by comprehensive supply chain, logistics, and inventory management capabilities, ensuring efficient end-to-end support.
Contact
Philippe Laban, General Manager
Sarah Soulié, Head of internal Packaging line
