CEA has developed a comprehensive IC design platform covering the full spectrum of design activities, including digital, analog, RF, and mixed-signal systems, across multiple technologies and process nodes. It also has strong expertise in hardware/software co-design and co-verification, supported by a team of more than 300 IC designers. Each year, CEA delivers over 30 ASICs, generates more than 30 patents, and publishes over 80 scientific papers, demonstrating its strong innovation capacity and scientific leadership.

CEA has extensive experience supporting SMEs and start-ups throughout the entire development cycle—from design to production—through mentoring, prototyping, and access to advanced design environments. It provides mentoring, prototyping, and access to advanced design environments.

Within IC-DASH, the project will leverage the outstanding experience gained by CEA teams over the past two decades in designing cutting-edge custom circuits for SMEs, offering support throughout the entire process, from product definition to production ramp-up. In addition, CEA runs a dedicated mentoring program for start-ups leveraging CEA technologies, ensuring that IC-DASH benefits from relevant expertise to support innovative SMEs in their go-to-market journey.

Within the IC-DASH project, CEA provides a comprehensive service offering covering the entire integrated circuit design value chain, from the early design stages through validation and industrialization. Leveraging its expertise and technologies in IC design (digital, analog, RF, and mixed-signal), CEA provides access to an advanced design environment and supports users throughout the semiconductor development lifecycle.

As part of Work Package 2 (WP2), CEA contributes to the deployment and operation of a secure, scalable, cloud-based design platform integrated with the EuroCDP central cloud infrastructure, enabling access to high-performance computing resources and advanced design tools. This platform also includes robust emulation capabilities for functional verification of integrated circuits, supporting hardware/software co-design and co-verification, and relies on the infrastructures of CEA as well as other consortium partners.

Within Work Package 3 (WP3), CEA provides technical support and high-level design expertise, assisting teams with the configuration, optimization, and automation of design flows, as well as the implementation of industry best practices, from architectural definition through to tape-out. The consortium also facilitates access to Multi-Project Wafer (MPW) runs and full reticle capabilities for prototyping and pilot manufacturing, as well as advanced semiconductor packaging solutions and silicon and package testing infrastructures, enabling functional, electrical, and performance validation of prototypes.

Last but not least, within Work Package 4 (WP4), CEA with other consortium members also develops synergies with other DET initiatives to expand the range of services and strengthen the European semiconductor ecosystem, while promoting and disseminating the IC-DASH platform among industrial and technological stakeholders across Europe.