Presto Engineering is a leading expert in ASIC design and semiconductor services. We help companies integrate proprietary microelectronic solutions into their products while controlling costs, reducing risks, and accelerating time-to-market. The company leverages strong expertise in ASIC development, silicon validation, and test engineering, supported by multidisciplinary teams with extensive industry experience.

Operating across the Industrial, Medical, Aerospace, Mobility, Quantum, and Photonics sectors, Presto Engineering has contributed to more than 200 ASIC and system-on-chip projects. The company also supports product qualification and industrialization, delivering high-value engineering services to over 1,000 customers, demonstrating its strong technical capabilities and ongoing commitment to quality and innovation.

A key differentiator lies in its end-to-end production and supply chain management capabilities. Presto Engineering enables seamless scaling from prototype to high-volume manufacturing through a well-established ecosystem of foundries, OSATs, and EMS partners. Its in-house European operations provide strategic flexibility, while custom buffer stock strategies help mitigate supply risks and demand fluctuations.

Presto Engineering offers a comprehensive Integrated Circuit Design and Advanced System Services Hub that spans the entire lifecycle of semiconductor development. Its end-to-end custom chip design capabilities begin with system specification and microarchitecture definition, followed by the development and integration of analog and mixed-signal Intellectual Property (IP), including power management units, sensor interfaces, high-speed and high-precision data converters, and clock synthesis blocks. The service also covers digital input/output (I/O), Microcontroller Units (MCUs), embedded memories, IP selection, Design for Testability (DFT), verification, synthesis, place-and-route, and Field-Programmable Gate Array (FPGA) prototyping, ensuring a seamless transition from concept to validated silicon.

In addition to chip design, Presto Engineering provides advanced System in Package (SiP) and packaging solutions that enable efficient multi-die integration. This includes detailed SiP and package architecture definition, substrate and package design, as well as comprehensive thermal and electrical simulations to guarantee performance, reliability, and robustness. By addressing the complexities of heterogeneous integration early in the design phase, the company ensures that final products meet stringent industrial and application-specific requirements.

The service offering is further strengthened by complete test, manufacturing, and characterization capabilities. Presto Engineering develops full test solutions, including hardware and software, test board design and manufacturing, functional validation, and environmental qualification to meet reliability standards. Manufacturing and assembly processes are carefully coordinated, covering wafer dicing, grinding, storage of both custom and Commercial Off-The-Shelf (COTS) dice, SiP assembly, and post-production testing. Finally, extensive characterization and industrial test services, such as Electrical Wafer Sort (EWS), final testing, analog and digital validation, and product certification support, to ensure that each device performs reliably in real-world conditions.